Product Details
Product Overview:
Showcasing the full spectrum of ceramic circuit excellence. Whether you require a complex, system-level motherboard with integrated component designators (LEDs/Thermistors) and edge connectors, or an ultra-high-density micro-submount array for mass-producing Laser Diodes ($CoS$), our facility delivers. Engineered on premium Alumina ($Al_2O_3$) with high-precision DPC metallization, these substrates offer the ultimate thermal management and electrical reliability for automotive lighting, medical sensors, and high-frequency communication modules.
Technical Specifications (Datasheet):
| Parameter |
Technical Data / Specification |
| Substrate Material |
96% / 99.6% High-Purity White Alumina ($Al_2O_3$) |
| Circuit Resolution |
High-Precision DPC (Direct Plated Copper) |
| Surface Finish |
Electroless Nickel Immersion Gold (ENIG) / Hard Gold for Fingers |
| Mechanical Shaping |
Custom Arch-Shaped (D-Shape) CNC Routing / Laser Cutting |
| Integration Features |
Silk-screened Component Designators (LED1-LED19, RT1, J1) |
| I/O Connectivity |
Integrated Gold Fingers (Edge Connector) for Solderless Mating |
| Array Architecture |
Massively Panelized with Precision Laser V-Scoring |
| Thermal Conductivity |
24 - 35 $W/m \cdot K$ (Stable thermal spreading) |
| Dielectric Strength |
> 15 $kV/mm$ (Ensuring high-voltage safety) |
| Compliance |
RoHS / ESD Protection Markings Integrated |
| Main Applications |
Automotive Lighting, Industrial LED Modules, Laser Diode Packaging ($CoS$), Medical Probes |
Manufacturing Advantage:
Our ability to handle both macro-scale system boards and micro-scale submount arrays on a single production line ensures unparalleled consistency and cost-efficiency. With precision CNC routing for complex geometries and ultra-fine DPC etching for dense pad layouts, we bridge the gap between heavy-duty thermal management and intricate signal routing. Our integrated silk-screening and hard-gold edge plating guarantee a "plug-and-play" experience for your automated assembly and final product integration.
*Note: Board shape, pad pitch, and connector configurations are 100% customizable. We support full-scale production and R&D prototyping. Please upload your Gerber data or CAD files for a comprehensive review.
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