Product Details
Product Overview:
Achieve next-level miniaturization with our high-density, multi-pad ceramic chip carriers. Specifically engineered for multi-die integration (MCM) and micro-sensor arrays, this substrate features an 18-unit vertical matrix coupled with dual power/ground rails on a premium Alumina core. Utilizing high-precision DPC or Thin-Film metallization, it ensures razor-sharp pad definitions and superior wire-bonding reliability, making it the ideal platform for compact optical modules, medical sensors, and high-density micro-electronics.
Technical Specifications (Datasheet):
| Parameter |
Technical Data / Specification |
| Substrate Material |
96% / 99.6% High-Purity White Alumina ($Al_2O_3$) |
| Circuit Configuration |
20-Pad High-Density Array (3x6 Matrix + 2 Headers) |
| Metallization Tech |
High-Precision DPC (Direct Plated Copper) / Thin-Film |
| Surface Finish |
Thick Wire-Bondable Gold (Au) / ENIG (Electroless Nickel) |
| Gold (Au) Thickness |
0.05 μm - 0.5 μm (Tailorable for Eutectic or Epoxy bonding) |
| Pad Pitch / Gap |
Ultra-Fine pitch control to prevent electrical crosstalk |
| Thermal Conductivity |
24 - 35 W/m·K (Consistent thermal spreading for micro-dies) |
| Dielectric Strength |
> 15 kV/mm (Ensuring channel-to-channel isolation) |
| Surface Roughness ($R_a$) |
< 0.3 μm (Polished for high-resolution patterning) |
| Main Applications |
Multi-Die LED Modules, Micro-Sensor Arrays, MCM Packaging, Fiber-Optic Transceivers |
Manufacturing Advantage:
Our micro-fabrication process delivers exceptional pad consistency and edge definition, which is critical for automated high-speed wire bonding. By maintaining strict control over the inter-pad isolation gaps, we guarantee zero leakage current between channels, ensuring the highest signal integrity for your integrated sensor or emitter networks. The high-purity gold surface is specifically treated to ensure robust, long-term adhesion for both gold-wire and aluminum-wire bonding processes.
*Note: Pad count, array layout, and board dimensions are 100% customizable. We support low-volume prototyping for high-tech startups and R&D labs. Please upload your Gerber data for an immediate quote.
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