Product Details
Product Overview:
Push the boundaries of micro-electronics with our ultra-complex, high-density ceramic IC carriers. Specifically engineered for applications requiring massive signal integration and micro-scale sensitivity—such as quantum computing, high-resolution biosensors, and 5G/6G RF modules. Featuring a precision-etched interdigitated array and multi-channel routing on a bespoke, non-rectangular AlN or Alumina substrate, this platform delivers unparalleled electrical performance and thermal stability for your most ambitious R&D projects.
Technical Specifications (Datasheet):
| Parameter |
Technical Data / Specification |
| Substrate Material |
High-Purity AlN (170-230 W/m·K) / 99.6% Alumina |
| Circuit Type |
High-Density Interdigitated (Comb) Array & Multi-Channel Routing |
| Metallization Technology |
State-of-the-Art DPC (Direct Plated Copper) / Thin-Film |
| Line Width / Spacing (L/S) |
Ultra-Fine Resolution down to < 20μm / 20μm |
| Surface Finish |
Thick Wire-bondable Soft Gold (Au > 0.5μm) / Eutectic Gold |
| Geometry |
Custom Non-Rectangular / Complex Heterogeneous Shape |
| Dimensional Tolerance |
± 0.01 mm (Strict precision for mechanical housing fitment) |
| Electrical Isolation |
Exceptional dielectric strength with zero crosstalk design |
| Surface Roughness (Ra) |
< 0.05 μm (Polished for high-resolution photolithography) |
| Main Applications |
Quantum Chip Carriers, Multi-Channel Biosensors, MMIC Packaging, Satellite Communication |
Manufacturing Advantage:
Achieving thousands of interdigitated traces on a complex, custom-milled ceramic substrate requires world-class lithography and dicing expertise. Our proprietary DPC process ensures razor-sharp trace definitions and consistent gold plating across the entire multi-level architecture. We offer 100% electrical testing and AOI inspection to guarantee zero short-circuits in these highly sensitive, mission-critical components.
*Note: Channel counts, interdigitated gap sizes, and substrate shapes are 100% customizable. We specialize in fast-turn prototyping for university labs and corporate R&D centers. Please upload your Gerber or CAD data for a confidential review.
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