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Wafer-Level Ceramic CoS Submount Array with Integrated Alignment Fiducials

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Product Details

Product Overview:

Redefine your packaging yield with our next-generation Wafer-Level Ceramic Carriers. Engineered on high-purity $Al_2O_3$ (99.6%) substrates, this 6-inch wafer-form array features integrated precision fiducial markers (cross-hairs) for flawless machine vision alignment. Designed to SEMI standards with a primary alignment flat, it integrates seamlessly into high-speed automated Die Bonders and Dicing systems. The ultimate solution for mass-producing Laser Diodes ($CoS$), Silicon Photonics, and RF Filters with micron-level placement accuracy.

Technical Specifications (Datasheet):

Parameter Technical Data / Specification
Substrate Material 99.6% Ultra-High Purity Alumina ($Al_2O_3$) / AlN Option
Wafer Form Factor 4-inch / 6-inch / 8-inch Circular Wafer
Alignment System 4-Quadrant Integrated Cross-Hair Fiducial Marks
Orientation Feature SEMI Standard Primary Flat (Bottom Flat)
Metallization Tech High-Precision DPC (Direct Plated Copper) / Thin-Film
Surface Finish Thick Soft Gold (Au > 0.5μm) / Eutectic-Ready Finish
Total Thickness Variation (TTV) < 10 μm (Critical for automated vacuum handling)
Surface Roughness ($R_a$) < 0.2 μm (Polished ceramic base for high-resolution pads)
Flatness (BOW/WARP) < 30 μm (Ensuring flawless machine vision focus)
Main Applications Wafer-Level Packaging (WLP), LiDAR Emitters, VCSEL Arrays, 800G Transceivers

Manufacturing Advantage:

Our wafer-level substrates with integrated fiducials eliminate the manual calibration bottleneck in your production line. The high-contrast cross-hair marks allow for instantaneous, sub-micron coordinate mapping by automated vision systems, significantly boosting pick-and-place speeds. Coupled with our industry-leading TTV and flatness control, these wafers ensure maximum contact uniformity for eutectic bonding and thermal-sonic wire bonding, driving your overall yield to new heights.

*Note: Array pitch, fiducial geometry, and metallization thickness are 100% customizable. We provide low-volume pilot runs for R&D labs. Please upload your SEMI-standard CAD data for a rapid quote.

Metallized silicon carbide ceramic substrate