Product Details
Product Overview: The ultimate 3D ceramic packaging solution for extreme thermal and high-current applications. Featuring an advanced multi-level stepped cavity design, this bespoke ceramic substrate integrates a high-density interdigitated (comb) metallization array with robust, heavy-duty mechanical mounting holes. Engineered for perfect optical alignment and direct heat-sink attachment, it is the premier choice for industrial UV LED printing arrays, TEC (Thermoelectric Cooler) modules, and high-power optoelectronics.
Technical Specifications (Datasheet):
| Parameter |
Specification |
| Substrate Material |
High-Purity Alumina (Al2O3) / Aluminum Nitride (AlN) |
| Structural Design |
Multi-level Stepped Cavity / 3D Terraced Architecture |
| Metallization Technology |
HTCC (High-Temperature Co-fired Ceramic) / High-precision DPC |
| Circuit Design |
High-density interdigitated array (Comb pattern) for high-current routing |
| Surface Finish |
Thick Wire-bondable Gold (Au) / ENIG |
| Mechanical Features |
Precision CNC-milled mounting holes (unplated) for screw/heat-sink attachment |
| Thermal Conductivity |
24 - 35 W/m·K (Al2O3) / 170+ W/m·K (AlN) |
| Die Attach Compatibility |
Optimized for Eutectic Soldering and high-reliability Epoxy |
| Main Applications |
Industrial UV-C LED Printing Heads, TEC (Peltier) Modules, LiDAR, Aerospace Optoelectronics |
Manufacturing Advantage: Our state-of-the-art ceramic machining and multi-layer co-firing capabilities allow us to create highly complex, multi-tiered substrates with extreme dimensional accuracy. The integrated mounting holes eliminate the need for secondary clamping fixtures, ensuring a flat, secure mount to your cold-plate or heat-sink for maximum thermal dissipation under extreme loads.
*Note: The stepped cavity depths, mounting hole diameters, and array geometries are 100% customizable. Please upload your 3D CAD models (STEP/IGES) or Gerber files for an immediate engineering review and quote.
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