Product Details
Product Overview:
Secure your sensitive integrated circuits and sensors with our high-reliability Ceramic Leadless Chip Carriers (CLCC). Engineered for the most demanding environments, this 3D cavity package features precision-etched internal perimeter pads optimized for high-speed gold wire bonding. With a standard chamfered corner for Pin 1 automated orientation and a flat top-ring designed for robust hermetic sealing (Lid attachment), it is the premier choice for aerospace, medical implantables, and high-performance MEMS devices.
Technical Specifications (Datasheet):
| Parameter |
Technical Data / Specification |
| Product Type |
CLCC (Ceramic Leadless Chip Carrier) / LCC |
| Substrate Material |
96% / 99.6% High-Purity White Alumina ($Al_2O_3$) |
| Lead Count |
24-Lead / 28-Lead (Customizable per client layout) |
| Surface Finish |
Electrolytic Gold (Au) over Nickel (Ni) / Wire-Bondable |
| Gold (Au) Purity |
99.99% (Optimized for ultra-reliable Wire Bonding) |
| Orientation Mark |
Precision Chamfered Corner (Pin 1 Identification) |
| Cavity Geometry |
3D Recessed Well with Internal Solder/Bond Pads |
| Thermal Conductivity |
24 - 35 W/m·K (High-purity thermal spreading) |
| Dielectric Strength |
> 15 kV/mm (Exceptional high-voltage isolation) |
| Operating Temp. |
-55°C to +250°C (Automotive & Military Grade) |
| Main Applications |
IC Packaging, MEMS Sensors, Medical Electronics, Satellite Components |
Manufacturing Advantage:
Our CLCC platforms are manufactured with strict adherence to dimensional tolerances, ensuring seamless integration into automated pick-and-place and wire-bonding equipment. The high-purity gold plating ensures a robust, void-free intermetallic bond during the wire-bonding process, while the ceramic’s superior thermal expansion matching ($CTE$) with silicon dies minimizes mechanical stress, guaranteeing the long-term integrity of your encapsulated electronics.
*Note: Lead count, cavity depth, and lid-seal interface are 100% customizable. We provide low-volume prototyping for high-reliability R&D. Please upload your CAD or Gerber data for an immediate quote.
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