Product Details
Product Overview:
Unleash raw thermal and electrical performance with our Heavy Bare Copper Ceramic Substrates. Engineered with a mathematically optimized hexagonal (honeycomb) matrix, this board provides the highest possible packing density for circular or point-source dies while ensuring omnidirectional heat spreading. Featuring ultra-thick, low-resistance bare copper metallization (via DPC or DCB processes) and four heavy-duty mechanical mounting holes, it is the ultimate thermal foundation for extreme-power UV curing arrays, COB grow lights, and power electronics.
Technical Specifications (Datasheet):
| Parameter |
Technical Data / Specification |
| Substrate Material |
96% / 99.6% High-Purity Alumina ($Al_2O_3$) OR Aluminum Nitride (AlN) |
| Metallization Technology |
DPC (Direct Plated Copper) / DCB (Direct Copper Bonded) |
| Surface Finish |
Raw Bare Copper (Customizable with ENIG, OSP, or Immersion Silver upon request) |
| Array Geometry |
High-Density Hexagonal / Honeycomb Matrix |
| Copper Thickness |
Heavy Copper capability (e.g., 2 oz, 3 oz, or tailored to high-current needs) |
| Thermal Conductivity |
24 - 35 W/m·K (Alumina) / 170 - 230 W/m·K (AlN) |
| Mechanical Machining |
4x Precision-drilled mounting holes for direct heat-sink / cold-plate attachment |
| Die Attach Compatibility |
Ideal for Eutectic soldering, Nano-silver sintering, or Thermal Epoxy |
| Thermal Spreading |
Uniform, omnidirectional heat dissipation eliminating thermal crowding |
| Main Applications |
High-Power UV-C Curing Systems, COB Horticultural Lighting, Laser Matrices, High-Current Power Modules |
Manufacturing Advantage:
Our advanced copper metallization processes allow for extreme copper thickness without compromising the precise isolation gaps of the honeycomb matrix. By delivering substrates with exceptional thermal mass and pre-routed mounting holes, we enable your assembly teams to securely mate the substrate directly to heavy-duty liquid cooling systems, ensuring maximum reliability under peak continuous loads.
*Note: Hexagon pad pitch, copper thickness, and mounting hole diameters are 100% customizable based on your thermal simulations. Please upload your CAD/Gerber data for a rapid engineering quote.
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