Product Details
Product Overview: High-precision ceramic PCB array (Panelized) engineered specifically for high-volume automated SMT assembly. Featuring integrated optical fiducial marks for exact machine alignment, complex DPC metallization, and premium wire-bondable gold finish. The ideal choice for mass-producing LED arrays, sensors, and RF modules.
Technical Specifications (Datasheet):
| Parameter |
Specification |
| Substrate Material |
96% Alumina (Al2O3) / Aluminum Nitride (AlN) |
| Thermal Conductivity |
24 - 28 W/m·K (Al2O3) / 170 W/m·K (AlN) |
| Board Format |
Multi-block Panelization (Custom Matrix Array) |
| SMT Alignment |
Built-in Optical Fiducial Marks (High-contrast for AOI) |
| Metallization Technology |
DPC (Direct Plated Copper) |
| Surface Finish |
ENIG (Ni: 3-5μm, Au: 0.05-0.1μm) / Electroplated Gold |
| Circuit Resolution |
High precision etching for complex trace layouts (e.g., L-pads) |
| Singulation Compatibility |
Optimized for Laser Dicing or Diamond Saw cutting post-assembly |
| Dimensional Tolerance |
±0.05mm |
| Main Applications |
Sensor Arrays, Optoelectronics packaging, Power Modules, Telecommunications |
Manufacturing Advantage: Our panelized ceramic substrates are delivered ready for your automated pick-and-place machines. The precise fiducials and uniform plating guarantee zero-defect alignment and maximum yield during mass production.
*Note: Fully customizable panel layouts and single-unit dimensions.
Please send your Gerber files to get an exact quote.
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