Product Details
Product Overview: The ultimate mass-production solution for advanced optoelectronic packaging. This high-density 3D cavity ceramic array combines precision routing, uniform DPC metallization, and a wire-bondable gold finish into a single, automated-ready panel. Engineered specifically for high-volume manufacturing of VCSEL arrays, UV-C LEDs, and micro-sensor modules, drastically reducing your assembly time and cost per unit.
Technical Specifications (Datasheet):
| Parameter |
Specification |
| Substrate Material |
High-Performance Aluminum Nitride (AlN) / Alumina ($Al_2O_3$) |
| Delivery Format |
Large-scale Matrix Array Panel (with breakaway/dicing rules) |
| Structure Design |
Precision 3D Micro-Cavities / Dam Structures |
| Metallization Technology |
High-precision DPC (Direct Plated Copper) |
| Surface Finish |
Thick Gold Plating / ENIG (Optimized for Eutectic & Wire Bonding) |
| Die Attach Compatibility |
Gold-Tin (AuSn) Eutectic Soldering, Silver Epoxy |
| Wire Bondability |
Excellent adhesion for Au and Al wire bonding |
| Automation Features |
Integrated Tooling Holes, Fiducial Marks, and Indexing Margins |
| Dimensional Tolerance |
Extremely tight pitch and cavity depth tolerance |
| Main Applications |
UV/IR LED Packaging, VCSEL Diodes, Optoelectronic Transceivers, High-Power Sensor Arrays |
Manufacturing Advantage: Our state-of-the-art DPC array technology guarantees zero-defect cavity dimensions and ultra-reliable gold plating across the entire panel. Delivered with full tooling margins for seamless integration into your automated die-attach and wire-bonding equipment, maximizing your throughput and yield.
*Note: Cavity depth, array pitch, and panel size are 100% customizable.
Please upload your CAD/Gerber files for an immediate engineering review and quote.
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