Product Details
Product Overview: Advanced high-frequency ceramic PCB engineered for demanding RF, Microwave, and Telecommunications applications. Manufactured on a premium Aluminum Nitride (AlN) core, this substrate features ultra-precise microstrip/coplanar waveguide etching, dense Plated Through Holes (PTH) for superior grounding, and exceptional thermal management capabilities. The ultimate solution for 5G/6G modules, radar systems, and aerospace electronics.
Technical Specifications (Datasheet):
| Parameter |
Specification |
| Substrate Material |
High-Purity Aluminum Nitride (AlN) |
| Thermal Conductivity |
170 W/m·K - 230 W/m·K |
| Dielectric Constant (Dk) |
8.8 @ 1MHz (Stable for High-Frequency signals) |
| Metallization Technology |
DPC (Direct Plated Copper) / Thin Film Sputtering |
| Surface Finish |
High-Reliability Wire-Bondable Gold / ENIG |
| Via Technology |
High-density Plated Through Holes (PTH), Thermal Vias, Blind Vias |
| Circuit Precision (L/S) |
Ultra-fine resolution for complex RF filters and antenna arrays |
| Profiling & Shaping |
Custom Laser Machining (Irregular outlines, slots, cavities) |
| Impedance Control |
Excellent (due to tight tolerance on ceramic thickness and trace width) |
| Main Applications |
RF/Microwave Power Amplifiers, 5G/6G Base Stations, Radar Systems, Optoelectronic Transceivers |
Manufacturing Advantage: Our proprietary laser drilling and precise DPC metallization ensure flawless via plating and perfectly sharp circuit edges, which are critical for minimizing insertion loss and maximizing signal integrity at GHz frequencies.
*Note: Fully customized RF layouts and via structures. Please upload your Gerber or CAD files for a comprehensive engineering review and fast quotation.
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