Product Details
Product Overview: Expertly engineered for Chip-on-Board (COB) packaging and high-power optoelectronics. This customized ceramic PCB strip features a precisely exposed central ceramic thermal pad for direct bare-die attach, ensuring maximum heat dissipation. Protected by a high-reliability Liquid Photo-Imageable (LPI) green solder mask and equipped with a row of gold-plated through-holes (PTH) for easy integration. The perfect substrate for UV/IR LEDs, advanced sensors, and compact power modules.
Technical Specifications (Datasheet):
| Parameter |
Specification |
| Substrate Material |
High-Purity Alumina ($Al_2O_3$) / Aluminum Nitride (AlN) |
| Packaging Concept |
COB (Chip-on-Board) / Direct Bare-Die Attach |
| Thermal Management |
Exposed central ceramic pad for optimal thermal transfer |
| Metallization Technology |
DPC (Direct Plated Copper) |
| Surface Finish |
Wire-bondable Soft Gold (Au) / ENIG |
| Solder Mask (Coverlay) |
Green LPI Solder Mask (Customizable: White, Black, None) |
| I/O Connectivity |
Row of Plated Through Holes (PTH) for signal/power routing |
| Array Format |
Strip-panelized for high-speed automated assembly |
| Thermal Conductivity |
24 - 35 W/m·K ($Al_2O_3$) / 170+ W/m·K (AlN) |
| Main Applications |
UV/IR LED Arrays, Gas/Optical Sensors, Medical Devices, Miniature RF Modules |
Manufacturing Advantage: Our precise DPC etching combined with exacting solder mask application guarantees that your bare dies have a pristine, flux-free ceramic surface for eutectic or epoxy mounting, while surrounding traces are fully protected from solder bridging. Delivered in a pre-routed strip format, it seamlessly integrates into your automated wire-bonding and testing equipment.
*Note: Central die-pad dimensions, PTH layout, and strip sizes are 100% customizable. Please upload your CAD/Gerber files for an immediate engineering review and quote.
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