Product Details
Product Overview: The ultimate turnkey packaging substrate solution for advanced semiconductor and optoelectronic manufacturing. This ultra-high-density ceramic submount array (AlN/$Al_2O_3$) is delivered pre-mounted on an industry-standard metal wafer ring (film frame) with UV release dicing tape. Engineered to eliminate your internal taping/mounting processes, this ready-to-load format integrates seamlessly into your automated dicing saws and high-speed die-bonding equipment, drastically reducing handling errors and maximizing production yield.
Technical Specifications (Datasheet):
| Parameter |
Specification |
| Substrate Material |
High-Thermal Aluminum Nitride (AlN) / Alumina ($Al_2O_3$) |
| Delivery Format |
Pre-mounted on Wafer Ring / Film Frame with Dicing Tape (UV Tape) |
| Array Architecture |
High-Density Rectangular Matrix (ideal for micro-submounts) |
| Metallization Technology |
High-precision DPC (Direct Plated Copper) |
| Surface Finish |
Thick Wire-bondable Gold (Au) / ENIG |
| Dicing Streets |
Clearly etched dicing lanes for high-precision diamond saw / laser singulation |
| Singulation Readiness |
UV Tape allows for clean, residue-free component pick-up after dicing |
| Die Attach Compatibility |
Optimized for AuSn Eutectic Soldering and Silver Epoxy |
| Main Applications |
Edge-Emitting Lasers (EEL), Photodiodes (PD), Optical Transceivers, Micro-RF Devices
|
*Note: Submount dimensions, array pitch, and wafer ring sizes (6-inch, 8-inch, etc.) are fully customizable. Please upload your CAD/Gerber files for an immediate engineering review and quote.
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