Product Details
Product Overview: Optimized for ultra-high-volume semiconductor and optoelectronic packaging, this standardized ceramic array panel features a proprietary outer plating bus (shorting ring) that guarantees absolute plating thickness uniformity across every single submount pad. Designed with specialized mechanical clamping slots and reinforced tooling holes, it provides a flawless, ready-to-use platform for high-speed automated die attach, wire bonding, and precision dicing (singulation).
Technical Specifications (Datasheet):
| Parameter |
Specification |
| Substrate Material |
High-Purity Alumina ($Al_2O_3$) / Aluminum Nitride (AlN) |
| Array Architecture |
High-Density Square Matrix (Panel-Level Packaging) |
| Metallization Technology |
High-precision DPC (Direct Plated Copper) |
| Plating Uniformity |
Exceptional uniformity ensured by integrated outer Plating Bus |
| Surface Finish |
Wire-bondable Soft Gold (Au) / ENIG (Optimized for Eutectic Attach) |
| Mechanical Handling |
Integrated L-shaped clamping slots and metallized tooling holes |
| Dicing Compatibility |
Precision etched dicing lanes (streets) for diamond saw singulation |
| Dimensional Tolerance |
Ultra-tight tolerance for zero-defect machine alignment |
| Main Applications |
LED Submounts, VCSEL Arrays, RF Transistors, Miniature Photodetectors, Thermistors |
Manufacturing Advantage: Our advanced DPC process, combined with smart plating bus design, eliminates the "dog-bone" effect and uneven plating often seen in large arrays. This ensures your die sits perfectly flat on every single pad. The strategically placed corner slots allow your automated equipment to clamp the panel securely without sacrificing active usable area, maximizing your per-panel yield.
*Note: Pad dimensions, dicing street widths, and panel sizes are 100% customizable to match your dicing equipment. Please upload your CAD/Gerber files for an immediate engineering review and quote.
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