Product Details
Product Overview: We offer premium high-purity Alumina ($Al_2O_3$) ceramic substrates, available as both raw bare boards and fully custom-metallized circuits. Utilizing advanced DPC (Direct Plated Copper) and Thin Film technologies, we transform blank ceramics into ultra-fine pitch, wire-bondable array substrates. The perfect turnkey solution for RF/Microwave, sensor arrays, and advanced IC packaging.
Technical Specifications (Datasheet):
| Parameter |
Specification |
| Substrate Material |
96% / 99.6% High-Purity Alumina ($Al_2O_3$) |
| Thermal Conductivity |
24 - 35 W/m·K |
| Surface Roughness (Ra) |
< 0.2 μm (Ultra-smooth for Thin Film processing) |
| Metallization Technology |
Thin Film Sputtering / High-Precision DPC |
| Surface Finish |
Wire-Bondable Gold (Au) / ENIG / Bare Copper |
| Line Resolution (L/S) |
Ultra-fine pitch down to 20μm - 50μm |
| Special Processing |
Plated Through Holes (PTH), Blind Vias, Optical Fiducials |
| Product Format |
Bare Ceramic Blanks OR Fully Metallized Array Panels |
| Dielectric Constant |
9.8 @ 1MHz (Excellent electrical insulation) |
| Main Applications |
RF/Microwave Circuits, Telecommunications, High-density Sensor Arrays, Microelectronics |
Manufacturing Advantage: By controlling the entire process from raw ceramic substrate selection to final precision etching and plating, we ensure industry-leading tolerance control, superior metal adhesion, and significant cost savings for your mass production.
*Note: Whether you need standard bare substrates or complex metallized layouts, we can deliver.
Please upload your Gerber/DXF files for a quick quote.
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