Product Details
Product Overview:
Engineered for uncompromising high-volume mass production. This panel-level packaging (PLP) ceramic substrate features an ultra-dense, 4-block rectangular matrix array on a high-reflectivity Alumina ($Al_2O_3$) core. Equipped with high-contrast gold optical fiducial marks, it guarantees zero-defect alignment for your high-speed automated SMT and wire-bonding equipment. The ultimate cost-effective and high-yield platform for mass-producing LED submounts, micro-sensors, and SMD components.
Technical Specifications (Datasheet):
| Parameter |
Specification |
| Substrate Material |
96% / 99.6% High-Purity White Alumina ($Al_2O_3$) |
| Array Architecture |
4-Block High-Density Rectangular Matrix (Panel Format) |
| Metallization Technology |
DPC (Direct Plated Copper) / Thick Film |
| Surface Finish |
Wire-bondable Soft Gold (Au) / ENIG |
| Optical Alignment |
6 Integrated Gold Fiducial Marks for AOI and SMT Vision Systems |
| Thermal Conductivity |
24 - 35 W/m·K (Excellent for general power optoelectronics) |
| Optical Property |
High surface reflectivity (Ideal for enhancing LED light extraction) |
| Singulation Compatibility |
Pre-defined dicing lanes for laser or diamond saw singulation |
| Main Applications |
General LED Packaging, Sensor Arrays, SMD Passive Components, Optocouplers |
Manufacturing Advantage:
Maximize your throughput and minimize handling time. By delivering components in a highly standardized, multi-block panel format with precise optical fiducials, we enable your automated lines to run at peak efficiency. The highly reflective white ceramic core not only provides excellent insulation and thermal stability but also boosts the luminous efficacy of your optoelectronic devices.
*Note: Array configurations, pad dimensions, and panel sizes can be fully tailored to your specific dicing and pick-and-place equipment. Please upload your Gerber files for a fast quote.
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