Product Details
Product Overview:
Elevate your semiconductor assembly yield with our semiconductor-grade Wafer-Level Ceramic Submounts. Fabricated on premium Aluminum Nitride ($AlN$) or high-purity Alumina substrates, these high-density arrays are delivered in industry-standard wafer carriers, ready for immediate integration into your automated Cleanroom production lines. Featuring ultra-precise DPC gold metallization and semiconductor-standard TTV (Total Thickness Variation) control, our ceramic wafers provide the ultimate thermal spreading platform for high-power Laser Diodes ($EEL/VCSEL$), Silicon Photonics, and advanced power ICs.
Technical Specifications (Datasheet):
| Parameter |
Technical Data / Specification |
| Substrate Material |
High-Purity $AlN$ (170-230 W/m·K) / 99.6% Alumina |
| Wafer Diameter |
4-inch / 6-inch / 8-inch Standard Form Factors |
| Delivery Packaging |
Sealed Anti-Static Wafer Carrier / Shipper (Cleanroom Ready) |
| Metallization Technology |
High-Precision DPC (Direct Plated Copper) |
| Surface Finish |
Thick Soft Gold (Au > 0.5μm) / Eutectic Gold-Tin ($AuSn$) options |
| Total Thickness Variation (TTV) |
< 10 μm (Across the entire wafer) |
| Singulation Compatibility |
Laser Scribing / V-cut (Optimized for automated dicing) |
| Alignment Marks |
Integrated SEMI Standard Flat & Global Fiducials |
| Surface Roughness ($R_a$) |
< 0.2 μm (Ceramic surface) / < 0.5 μm (Gold surface) |
| Main Applications |
Chip-on-Submount ($CoS$), Laser Diode Packaging, LiDAR, 400G/800G Transceivers |
Manufacturing Advantage:
Our wafer-level approach eliminates the manual handling of individual submounts, drastically reducing the risk of contamination and mechanical damage. By maintaining strict control over dicing lane alignment and plating uniformity, we ensure that every unit from the center to the edge of the wafer performs identically. Delivered in specialized wafer shippers, our products are engineered to bypass your incoming inspection bottlenecks and go straight to your automated assembly tools.
*Note: Wafer diameter, unit pitch, and metallization thickness are 100% customizable. Please upload your CAD or SEMI-standard design files for an immediate quote.
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