Product Details
Product Overview: Engineered for advanced optical and lighting applications, this custom annular (ring-shaped) ceramic PCB perfectly combines high thermal conductivity with traditional PCB processes. Featuring precision laser-routed mounting notches, a central optical aperture, and a highly reliable Liquid Photo-Imageable (LPI) solder mask. This is the ultimate packaging substrate for automotive LED headlights, camera lens modules, and high-power circular sensor arrays.
Technical Specifications (Datasheet):
| Parameter |
Specification |
| Substrate Material |
High-Purity Alumina (Al2O3) / Aluminum Nitride (AlN) |
| Board Shape |
Custom Annular / Circular with Inner Aperture |
| Machining Precision |
Laser profiling for complex outer notches and inner routing |
| Solder Mask (Coverlay) |
Green LPI Solder Mask (Custom colors: White, Black available) |
| Metallization Technology |
DPC (Direct Plated Copper) / Thick Film |
| Surface Finish |
ENIG (Electroless Nickel Immersion Gold) / Flash Gold |
| Pad & Via Design |
Exposed gold pads with mechanical mounting holes / Plated Through Holes (PTH) |
| Thermal Conductivity |
24 - 35 W/m·K (Al2O3) / 170+ W/m·K (AlN) |
| Dielectric Strength |
> 15 kV/mm |
| Main Applications |
Automotive LED Headlights, LiDAR Housings, Security Camera Rings, Optical Encoders |
Manufacturing Advantage: Our advanced laser routing technology allows for completely bespoke ceramic shaping to fit perfectly within your cylindrical housings. The robust application of LPI solder mask on the ceramic core prevents solder bridging during dense LED assembly, ensuring exceptional reliability and high-yield automated SMT processing.
*Note: The inner aperture diameter, outer notches, and solder mask colors are 100% customizable to your mechanical design. Please upload your CAD/Gerber files for a fast engineering review.
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