Product Details
Product Overview: Advanced double-sided metallized ceramic substrate designed for ultra-high-density packaging and superior thermal management. Featuring an ultra-fine pitch circuit array on the top side for complex chip mounting, and large solid metallized thermal pads on the bottom side for direct heat-sink soldering. The ultimate DPC solution for Mini/Micro LED displays, dense sensor arrays, and multi-chip power modules.
Technical Specifications (Datasheet):
| Parameter |
Specification |
| Substrate Material |
96% Alumina ($Al_2O_3$) / Aluminum Nitride (AlN) |
| Metallization Technology |
Double-Sided DPC (Direct Plated Copper) |
| Top Layer Design |
Ultra-fine pitch array (L/S down to 30μm-50μm) |
| Bottom Layer Design |
Solid Metallized Thermal Pads (for optimal heat dissipation) |
| Thermal Conductivity |
24 W/m·K ($Al_2O_3$) / 170 W/m·K (AlN) |
| Surface Finish |
Wire-bondable Soft Gold (Au) / ENIG (both sides) |
| Assembly Compatibility |
Top: Wire Bonding / Flip Chip; Bottom: Solder Reflow |
| SMT Alignment |
Built-in high-contrast optical Fiducial Marks |
| Dimensional Tolerance |
High precision via Laser Machining & Routing |
| Main Applications |
Mini/Micro LED Backplanes, Optoelectronic Arrays, Multi-Chip Modules (MCM), High-Power Sensors |
Manufacturing Advantage: Our double-sided DPC process ensures excellent adhesion and perfect alignment between top circuits and bottom thermal pads. The robust wire-bondable gold finish guarantees maximum yield for your automated wire bonding and die-attach processes, significantly lowering your overall packaging costs.
*Note: We offer fully customized front-and-back layouts.
Please upload your Gerber files (including top, bottom, and drill layers) for a rapid engineering review and quote.
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