Product Details
Product Overview: Precision-engineered high-density ceramic submount array (AlN/Al2O3) designed for automated microelectronics packaging and high-power LED/laser applications. Featuring ultra-fine pitch DPC metallization and excellent wire-bondable gold plating to ensure maximum thermal management and assembly yield.
Technical Specifications (Datasheet):
| Parameter |
Specification |
| Substrate Material |
96% Alumina ($Al_2O_3$) / Aluminum Nitride (AlN) |
| Thermal Conductivity |
24 W/m·K ($Al_2O_3$) / 170 W/m·K (AlN) |
| Delivery Format |
Matrix Array / Panel (Ready for automated SMT & Dicing) |
| Metallization Technology |
DPC (Direct Plated Copper) / Thin Film |
| Surface Finish |
Wire-bondable Soft Gold / ENIG |
| Min. Pad Size / Spacing |
Ultra-fine pitch (Customizable down to 50μm) |
| Dimensional Tolerance |
High precision (±0.025mm to ±0.05mm) |
| Surface Roughness (Ra) |
< 0.3 μm (Smooth surface for high-yield die attach) |
| Main Applications |
High-power LED packaging, Laser Diode Submounts, Sensor Matrix, RF/Microwave components |
Manufacturing Advantage: Our submount arrays are optimized for high-volume dicing and automated die-attach/wire-bonding processes, significantly reducing your packaging costs and improving overall reliability.
*Note: 100% customizable array layouts.
Please upload your Gerber/DXF files for a rapid quote.
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