Product Details
Product Overview:
Engineered for extreme power density and superior electrical isolation. This heavy-duty ceramic substrate features large-area gold-plated bus bars for maximum current carrying capacity, integrated with a high-density thermal via matrix for rapid heat dissipation. With clearly etched polarity markings (+/-) and optimized creepage distances for high-voltage safety, it is the premier platform for industrial IGBT modules, high-capacity Thermoelectric Coolers (TEC), and power conversion systems.
Technical Specifications (Datasheet):
| Parameter |
Technical Data / Specification |
| Substrate Material |
High-Thermal Aluminum Nitride (AlN) / 96% Alumina ($Al_2O_3$) |
| Circuit Design |
High-Current Bus Bar Layout with Integrated Thermal Via Array |
| Metallization Technology |
High-precision DPC (Direct Plated Copper) / AMB (Active Metal Brazing) |
| Copper (Cu) Thickness |
Heavy Copper capability (1 oz - 4 oz+ for high current handling) |
| Surface Finish |
Thick Soft Gold (Au > 0.5μm) / ENIG (Optimized for Wire Bonding) |
| Thermal Management |
Matrix of Plated Through-Hole (PTH) Thermal Vias |
| Polarity Indicators |
Laser-etched "+" and "-" markings for error-free assembly |
| Dielectric Strength |
> 15 kV/mm (Ensuring high-voltage isolation safety) |
| Thermal Conductivity |
170 - 230 W/m·K (AlN) or 24 - 35 W/m·K (Alumina) |
| Mechanical Machining |
4x Precision-drilled mounting holes for high-torque attachment |
| Main Applications |
IGBT Power Modules, TEC (Peltier) Controllers, Solar Inverters, EV Power Units |
Manufacturing Advantage:
Our advanced heavy-copper metallization process ensures zero voids in the thermal vias, providing an uninterrupted heat path from your power dice to the cooling plate. By designing with generous clearance and creepage distances, we provide a safe and reliable substrate that meets the strictest international standards for high-voltage industrial and automotive electronics.
*Note: Bus bar geometry, via pitch, and board dimensions are 100% customizable. Please upload your CAD or Gerber data for an immediate review.
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