Product Details
Product Overview：Direct Plated Copper (DPC) on Aluminum Nitride (AlN) ceramic substrate, offering ultra-high thermal conductivity and excellent electrical insulation. Ideal for high-power semiconductor packaging, IGBT modules, and optoelectronics.
Technical Specifications (Datasheet):
| Parameter |
Specification |
| Substrate Material |
Aluminum Nitride (AlN) |
| Thermal Conductivity |
170 W/m·K - 230 W/m·K |
| Standard Ceramic Thickness |
0.38mm / 0.50mm / 0.635mm / 1.0mm (Customizable) |
| Metallization Process |
DPC (Direct Plated Copper) |
| Copper (Cu) Layer Thickness |
10μm - 140μm (Customizable based on design) |
| Surface Finish |
ENIG (Ni: 3-5μm, Au: 0.05-0.1μm) or Electroplated Gold |
| Min. Line Width / Spacing (L/S) |
50μm / 50μm |
| Coefficient of Thermal Expansion (CTE) |
4.5 ppm/°C |
| Dielectric Constant |
8.8 @ 1MHz |
| Main Applications |
High-power LED, IGBT modules, Laser Diodes, RF/Microwave |
* Note: We support fully customized DPC/AMB ceramic PCBs.
Please upload your Gerber file for a quick quote.
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