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Heavy Copper AMB/DCB Ceramic Substrate Panel for IGBT & SiC Modules

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Product Details

Product Overview: Industrial-grade Heavy Copper Ceramic Substrate Panel, expertly manufactured using AMB (Active Metal Brazing) or DCB (Direct Copper Bonding) technology. Featuring a high-reliability Silicon Nitride ($Si_3N_4$) or Aluminum Nitride (AlN) core, this panel is engineered to withstand extreme thermal cycling and carry ultra-high currents. The ultimate foundation for EV traction inverters, IGBT modules, and SiC power electronics.

Technical Specifications (Datasheet):

Parameter Specification
Substrate Material Silicon Nitride ($Si_3N_4$) / Aluminum Nitride (AlN)
Metallization Technology AMB (Active Metal Brazing) / DCB (Direct Copper Bonding)
Copper (Cu) Thickness 0.3mm (300μm) up to 0.8mm (800μm) - Heavy Copper
Thermal Conductivity 90 W/m·K ($Si_3N_4$) / 170 W/m·K (AlN)
Surface Finish Electroless Nickel Plating (Ni: 3-8μm) / ENIG / Bare Copper
Panelization Structure Pre-routed panel with stress-relief slots and breakaway tabs
Mechanical Alignment Integrated Tooling Holes for heavy-duty automated assembly
Bending Strength > 650 MPa (for $Si_3N_4$) - Excellent fracture toughness
Thermal Cycling Reliability > 5,000 cycles (-40°C to +150°C)
Main Applications Electric Vehicle (EV) Inverters, Wind/Solar Power Inverters, Rail Transit, High-power IGBT & SiC Mosfet Modules
 
 
Manufacturing Advantage: Delivered in a highly optimized breakaway panel format with precision routing. Our advanced AMB/DCB process guarantees void-free copper bonding and superior thermal fatigue resistance, significantly extending the lifespan of your power modules under harsh operational conditions.

*Note: Fully customizable copper thickness and routing layouts. Please upload your CAD/Gerber files for an immediate engineering review and quote.
Medical series ceramic circuit boards, custom-made DPC aluminum nitride gold-plated process ceramic boards, high-precision ceramic boards