Product Details
Product Overview: State-of-the-art 3D metallized ceramic package array featuring a high thermal conductivity Aluminum Nitride (AlN) core. Engineered with precision cavity structures and thick gold-plated dams, this substrate is specifically designed for hermetic sealing, eutectic die-attach, and wire bonding. The ultimate packaging solution for high-power UV-C LEDs, VCSELs, and optoelectronic components.
Technical Specifications (Datasheet):
| Parameter |
Specification |
| Substrate Material |
High-performance Aluminum Nitride (AlN) |
| Thermal Conductivity |
170 W/m·K - 230 W/m·K |
| Structure Design |
3D Cavity / Dam Structure (Supports Hermetic Sealing) |
| Metallization Technology |
High-precision DPC (Direct Plated Copper) |
| Surface Finish |
High-reliability Thick Gold Plating / ENIG / ENEPIG |
| Wire Bondability |
Excellent for Gold (Au) and Aluminum (Al) Wire Bonding |
| Die Attach Compatibility |
Supports Eutectic Soldering (AuSn) and Silver Epoxy |
| Format |
Panelized Matrix Array with Mechanical Alignment Holes |
| Cavity Tolerance |
Strict dimensional control for precise lens/window mounting |
| Main Applications |
UV-C / Deep UV LEDs, VCSEL Arrays, LiDAR Sensors, High-power Laser Diodes, RF/Microwave Packaging |
Advanced Packaging Ready: Delivered in an automated-friendly array format. The integrated 3D metalized cavity walls provide optimal light reflection and a robust platform for flux-free lid/glass sealing, ensuring long-term reliability in harsh environments.
*Note: 100% bespoke cavity designs and routing.
Please upload your 3D CAD models (STEP/IGES) or Gerber files for a rapid engineering review and quote.
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