Product Details
Product Overview:
Combine high-end aesthetics with extreme thermal management. This circular, high-power ceramic substrate is specifically engineered for high-intensity industrial lighting, UV curing systems, and high-power RF modules. Featuring a precision-etched black solder mask for zero-light-interference and a comprehensive peripheral thermal via ring for rapid heat dissipation, it offers a robust platform for multi-die COB integration with on-board passive components. Its four heavy-duty mounting points ensure maximum mechanical stability under high-vibration and extreme-temperature environments.
Technical Specifications (Datasheet):
| Parameter |
Technical Data / Specification |
| Substrate Material |
Black Alumina ($Al_2O_3$ 96%) / Aluminum Nitride (AlN) with Black Mask |
| Circuit Layout |
High-Density Multi-Pad Matrix with Peripheral Thermal Vias |
| Metallization Tech |
High-Precision DPC (Direct Plated Copper) |
| Surface Finish |
High-Reliability ENIG (Electroless Nickel Immersion Gold) |
| Thermal Management |
Ring of Plated Through-Hole (PTH) Thermal Vias |
| Optical Contrast |
Matte Black Solder Mask (Optimized for AOI & Stray Light Suppression) |
| Copper (Cu) Thickness |
35 μm - 100 μm (Customizable for high-current loads) |
| Mounting Features |
4-Point Reinforced Mounting Flanges (Standard Industrial Pitch) |
| Dielectric Strength |
> 15 kV/mm (High-voltage safety for power electronics) |
| Operating Temp. |
Continuous operation up to 250°C (Base substrate) |
| Main Applications |
Searchlights, Stage Lighting, Industrial UV Curing, Power RF Modules, Drone Lighting |
Manufacturing Advantage:
Our proprietary black solder mask technology ensures superior adhesion and thermal stability, preventing yellowing or delamination even under intense UV exposure or continuous high-wattage operation. By integrating a dense ring of laser-drilled thermal vias, we create a specialized heat-path that significantly lowers the junction temperature of your power LEDs, extending their lifespan and maximizing luminous efficiency.
*Note: Array diameter, via density, and solder mask color (e.g., White/Green/Blue) are 100% customizable. Please upload your Gerber data for an immediate engineering review.
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