Product Details
Product Overview:
Optimize your space-constrained power modules with our custom hexagonal ceramic substrates. Specifically designed for bridge rectifiers, high-power transistors (MOSFET/IGBT), and specialized sensor headers, this substrate features a precision-chamfered geometry for perfect fitment into circular housings or compact enclosures. Utilizing high-adhesion DPC or Thick Film metallization, the perimeter pad layout ensures low-resistance electrical connections while the central alumina core provides maximum thermal spreading and high-voltage isolation.
Technical Specifications (Datasheet):
| Parameter |
Technical Data / Specification |
| Substrate Material |
96% / 99.6% High-Purity White Alumina ($Al_2O_3$) |
| Board Geometry |
Hexagonal / Chamfered Rectangle (Custom Shape) |
| Metallization Tech |
High-Precision DPC (Direct Plated Copper) / Thick Film |
| Pad Configuration |
Perimeter L-shaped & Rectangular Pads (Optimized for Wire Bonding) |
| Surface Finish |
Bare Copper / ENIG (Electroless Nickel Immersion Gold) |
| Thermal Conductivity |
24 - 35 W/m·K (Optimized for high-current thermal loads) |
| Dielectric Strength |
> 15 kV/mm (Ensuring safety for high-voltage rectifiers) |
| Copper (Cu) Thickness |
35 μm - 75 μm (Tailored for heavy-duty power cycling) |
| Dimensional Tolerance |
± 0.05 mm (Strict control for mechanical housing fitment) |
| Insulation Resistance |
> $10^{14}$ $\Omega \cdot cm$ |
| Main Applications |
Power Bridge Rectifiers, MOSFET/IGBT Packaging, Pressure Sensors, RF Headers |
Manufacturing Advantage:
Our precision CNC or laser-shaping technology ensures that every hexagonal edge and chamfer is clean and burr-free, preventing mechanical stress during your assembly process. The robust metallization layer is specifically formulated to withstand multiple thermal cycles and high-torque soldering, ensuring that your power modules remain reliable even in the harshest industrial or automotive environments.
*Note: Hexagon dimensions, pad layout, and metallization thickness are 100% customizable. Please upload your STEP file or Gerber data for an immediate engineering review.
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