Product Details
Product Overview:
Provide the ultimate thermal and mechanical protection for your high-value semiconductor dies. This 3D cavity ceramic submount is engineered with a precision-recessed well that acts as both a protective housing and a natural reflector. Fabricated on high-purity Aluminum Nitride ($AlN$) with heavy gold metallization, it features a specialized pad layout for seamless die-attachment and dual-wire bonding. The premier choice for high-power Laser Diodes ($LD$), Deep UV-C emitters, and mission-critical sensors.
Technical Specifications (Datasheet):
| Parameter |
Technical Data / Specification |
| Substrate Material |
High-Purity Aluminum Nitride ($AlN$) / Alumina |
| Structure Type |
Integrated 3D Micro-Cavity (Reflective Well) |
| Metallization Tech |
High-Precision DPC (Direct Plated Copper) |
| Surface Finish |
Thick Soft Gold (Au > 0.5 μm) / Eutectic-Ready |
| Pad Configuration |
Central Die-Attach Pad + Dual L-Shaped Wire-Bond Pads |
| Thermal Conductivity |
170 - 230 W/m \cdot K (AlN Grade) |
| Cavity Depth |
Customizable (Typical 0.1mm - 0.3mm) |
| Dielectric Strength |
> 15 kV/mm |
| Bonding Compatibility |
Excellent for AuSn Eutectic or Nano-Silver Sintering |
| Dimensional Tolerance |
± 0.02 mm (High-precision micro-machining) |
| Main Applications |
UV-C Sterilization, Laser Diode Thermal Management, LiDAR Sensors, High-Power VCSELs |
Manufacturing Advantage:
Our advanced micro-machining and DPC plating processes allow us to create deep cavities with perfectly metallized vertical or sloped sidewalls. This integrated 3D structure ensures that your sensitive dies are shielded from handling damage while significantly boosting light extraction efficiency through its reflective properties. The thick, high-purity gold surface guarantees ultra-reliable wire bonds and void-free eutectic attachment, driving the performance limits of your optoelectronic devices.
*Note: Cavity geometry, pad dimensions, and substrate thickness are 100% customizable to your chip's footprint. Please upload your STEP or Gerber files for an immediate engineering review.
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