Product Details
Product Overview: The premium thermal management solution for high-power laser and optoelectronic packaging. Built on a high-thermal-conductivity Aluminum Nitride (AlN) core (dark substrate), this ultra-high-density submount array is engineered for Chip-on-Submount (CoS) applications. Featuring uniform DPC gold metallization, precision indexing marks, and tooling holes, it ensures zero-defect automated assembly and maximum heat dissipation for your most demanding semiconductor devices.
Technical Specifications (Datasheet):
| Parameter |
Specification |
| Substrate Material |
High-Purity Aluminum Nitride (AlN) / Black Alumina |
| Thermal Conductivity |
170 W/m·K - 230 W/m·K (AlN) |
| Delivery Format |
Mass-Production Matrix Array Panel |
| Metallization Technology |
High-precision DPC (Direct Plated Copper) / Thin Film |
| Surface Finish |
Wire-bondable Soft Gold (Au) / ENEPIG / ENIG |
| Plating Uniformity |
Exceptional uniformity ensured by optimized plating bus design |
| Die Attach Compatibility |
Ideal for AuSn Eutectic Soldering and High-Temp Brazing |
| Automation Integration |
Integrated Tooling Holes and Dicing Index Marks |
| Dimensional Tolerance |
Ultra-tight tolerance for precision wafer dicing / singulation |
| Main Applications |
Laser Diodes (CoS), LiDAR, Optical Transceivers, High-Power RF Amplifiers, UV-C LEDs
|
Manufacturing Advantage: Our advanced metallization process guarantees extremely flat and uniform gold pads across the entire panel, which is critical for void-free eutectic die attach. The precise indexing margins and pre-designed tooling holes allow for seamless integration into your automated pick-and-place and dicing equipment, significantly boosting your mass production yield.
*Note: Array pitch, pad dimensions, and plating thickness are 100% customizable.
Please upload your CAD/Gerber files for an immediate engineering review and quote.
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