Product Details
Product Overview: The ultimate ceramic packaging solution engineered specifically for high-power optoelectronics. Featuring meticulously crafted circular 3D cavities (reflector cups), this panelized array is designed to maximize light extraction and seamlessly accommodate dome lenses. Coated with a premium wire-bondable and eutectic-ready gold finish, it provides the perfect foundation for automated mass-production of UV LEDs, VCSELs, and high-frequency photodiodes.
Technical Specifications (Datasheet):
| Parameter |
Specification |
| Substrate Material |
High-Thermal Aluminum Nitride (AlN) / Alumina ($Al_2O_3$) |
| Structure Design |
Precision Circular 3D Cavities / Optical Reflector Cups |
| Delivery Format |
Mass-Production Matrix Array Panel |
| Metallization Technology |
High-precision DPC (Direct Plated Copper) |
| Surface Finish |
Full Thick Gold Plating / ENIG (Optimized for Optoelectronics) |
| Die Attach Compatibility |
Excellent for AuSn Eutectic Soldering & Silver Epoxy |
| Wire Bondability |
Superior adhesion for Gold (Au) wire bonding |
| Automation Integration |
Built-in Tooling Holes, Fiducials, and Indexing Marks for ultra-precise machine alignment |
| Cavity Tolerance |
Strict dimensional control for exact lens matching and potting |
| Main Applications |
Deep UV-C LEDs, VCSEL Arrays, Laser Diodes, Photodetectors, Optical Transceivers |
Manufacturing Advantage: Our proprietary DPC process creates flawless circular cavities with highly reflective metallized walls, drastically improving optical output efficiency. Delivered with full tooling margins and indexing marks, this panel integrates flawlessly into your high-speed automated die-attach and wire-bonding lines, driving down your cost-per-part while maximizing yield.
*Note: Cavity diameter, depth, and array pitch are fully customizable.
Please upload your CAD/Gerber files for an immediate engineering review and quote.
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