Product Details
Product Overview: Engineered for ultimate precision and zero-defect mass production, this high-density circular ceramic array features complex interdigitated electrodes (IDE) tailored for advanced sensors and microelectronics. Every single panel undergoes strict 100% Automated Optical Inspection (AOI) and electrical testing, with defective submounts clearly ink-marked (Bad Marks) to ensure your automated pick-and-place equipment achieves 100% yield on assembly.
Technical Specifications (Datasheet):
| Parameter |
Specification |
| Substrate Material |
High-Purity Alumina ($Al_2O_3$) / Aluminum Nitride (AlN) |
| Array Format |
High-Density Circular Submounts (Panelized) |
| Metallization Technology |
High-precision DPC (Direct Plated Copper) / Thin Film |
| Circuit Design |
Ultra-fine Interdigitated Electrodes (IDE) / Custom Patterns |
| Line Width / Spacing (L/S) |
Micro-level precision (down to 20μm - 50μm) |
| Surface Finish |
Wire-bondable Gold (Au) / ENIG |
| Quality Control |
100% AOI Inspected with Ink Marking for defective units |
| Automation Integration |
Full Tooling Holes and Indexing Marks for precise Wafer Dicing |
| Assembly Compatibility |
Ready for Automated SMT, Wire Bonding, and TO-Can Packaging |
| Main Applications |
Gas/Humidity Sensors, Biosensors, RF Components, TO-can Laser Diodes, Wearable Devices |
Manufacturing Advantage: We don't just manufacture; we guarantee reliability. By integrating 100% AOI and electrical testing before shipment, we eliminate your incoming quality control (IQC) headaches. Our precise DPC etching ensures flawless fine-pitch electrodes, while the indexing margins allow for seamless, high-speed automated dicing (singulation).
*Note: Electrode patterns, circular diameters, and array layouts are fully customizable. Please upload your Gerber files for an immediate engineering review and quote.
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