Product Details
Product Overview: Engineered for the most extreme thermal and mechanical environments, this specialized Aluminum Nitride (AlN) submount array panel features an innovative central stress-relief slot to prevent warpage and ensure absolute flatness during high-temperature die attach. Featuring elongated precision-etched gold pads and fully indexed tooling margins, it is the ultimate DPC substrate for Edge-Emitting Lasers (EEL), High-Power RF Amplifiers, and advanced optical modules.
Technical Specifications (Datasheet):
| Parameter |
Specification |
| Substrate Material |
High-Thermal Aluminum Nitride (AlN) |
| Thermal Conductivity |
170 W/m·K - 230 W/m·K |
| Structural Design |
Pre-routed Central Slot for Thermal Stress Relief |
| Metallization Technology |
High-precision DPC (Direct Plated Copper) |
| Surface Finish |
Thick Soft Gold (Au) / ENIG (Optimized for Eutectic Die Attach) |
| Pad Geometry |
Elongated rectangular array (customizable for EEL & RF dies) |
| Edge Features |
High-contrast indexing marks and precision tooling holes |
| Thermal Cycling Reliability |
Exceptional (Zero warpage due to stress-relief design) |
| Die Attach Compatibility |
Ideal for AuSn Eutectic Soldering and Silver Epoxy |
| Main Applications |
Edge-Emitting Lasers (EEL), Optical Transceivers, High-Power RF/Microwave Modules, Aerospace Electronics |
Manufacturing Advantage: Our advanced routing and laser-cutting capabilities allow for complex panel structures, such as stress-relief slots, without compromising the integrity of the AlN ceramic. Combined with our flawless DPC metallization and comprehensive indexing margins, this panel is 100% ready for your automated pick-and-place and diamond saw dicing equipment.
*Note: Array dimensions, pad shapes, and slot designs are fully customizable.
Please upload your CAD/Gerber files for an immediate engineering review and quote.
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