Product Details
Product Overview:
Experience the pinnacle of high-yield microelectronics packaging. This ultra-high-density ceramic substrate panel is engineered specifically for fully automated, high-speed Die Attach and Wire Bonding lines. Utilizing advanced DPC technology, it features intricate micro-pad designs surrounded by a robust, intelligent plating bus. This smart border is fully equipped with machine-readable directional arrows, precision indexing tick marks, mechanical tooling holes, and etched traceability codes. The ultimate foolproof foundation for mass-producing Micro-LEDs, VCSEL arrays, and high-density optical sensors.
Technical Specifications (Datasheet):
| Parameter |
Technical Data / Specification |
| Substrate Material |
High-Thermal Aluminum Nitride (AlN) / 96% Alumina ($Al_2O_3$) |
| Array Architecture |
Ultra-High-Density Micro-Submount Matrix (Panel-Level) |
| Metallization Technology |
High-precision DPC (Direct Plated Copper) |
| Line Width / Spacing (L/S) |
Ultra-fine resolution (Micro-scale etching for complex pad geometries) |
| Surface Finish |
Thick Soft Gold (Au) / ENIG (Flawless for Eutectic and Epoxy Die Attach) |
| Plating Uniformity |
Absolute center-to-edge consistency guaranteed by continuous Outer Bus |
| Machine Vision Integration |
Integrated Directional Arrows, Indexing Ticks, and Fiducials |
| Mechanical Handling |
Precision-drilled Tooling Holes for zero-shift automated clamping |
| Traceability |
Laser/Etched part numbers and lot codes directly on the plating bus |
| Singulation Compatibility |
Pre-defined dicing lanes for high-speed Diamond Saw / Laser separation |
| Main Applications |
Micro-LED Displays, VCSEL LiDAR Arrays, Miniature Photo-detectors, Implantable Medical Sensors |
Manufacturing Advantage:
We design substrates that your assembly machines love. By integrating directional feeding arrows, vision indexing marks, and traceability codes right into the uniform plating bus, we virtually eliminate human loading errors and machine alignment faults. Coupled with our micro-meter DPC etching capabilities, this panel guarantees pristine, void-free bonding surfaces for thousands of micro-dies simultaneously.
*Note: Micro-pad geometries, array grid dimensions, and specific traceability codings are 100% customizable. Please upload your CAD or Gerber data for an immediate engineering review.
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